資料來源:https://www.seeedstudio.com/BGA-Reballing-Practice-Kit-p-1806.html
Description
A kit with (almost) everything you need to reball your first BGA chip! Includes the exact brands and tools used by Hacker Camp Shenzhen to teach BGA reballing at a mobile phone repair school. Accompanies the
Hacker Camp Shenzhen 2014 BGA workshop video from Dangerous Prototypes.
Packing List:
- Recycled mobile phone (chip donor)
- Solder paste
- Flux
- Spatula
- Tweezers right angle (ST-15)
- Tweezers sharp (ST-11)
- Knife and flat blade
- BGA stencil
- PCB holder
- Screw driver
- Phone opening tools
- Cotton sticks
- Dangerous Prototypes stickers
You will need to bring your own (B.Y.O.):
- Soldering iron (any will work)
- Hot air rework station
- Acetone (or nail polish remover)
- Tissues
More information about the product, please click
here.
Technical Details
Dimensions |
270mm x 165mm x 50mm |
Weight |
G.W 506g |
Battery |
Exclude |
描述
試劑盒,你需要重新植球的第一BGA芯片(幾乎)一切!包括使用黑客訓練營在深圳一手機維修留校任教BGA植球準確的品牌和工具。伴隨
黑客大本營深圳2014年 BGA車間從危險原型視頻。
打包清單:
- 回收的手機(芯片供體)
- 錫膏
- 助焊劑
- 抹刀
- 鑷子直角(ST-15)
- 鑷子銳(ST-11)
- 刀,平刀
- BGA模板
- PCB架
- 螺絲刀
- 手機開機工具
- 棉枝
- 危險的原型貼紙
您需要帶上自己的(BYO):
- 烙鐵(任意將工作)
- 熱風拆焊台
- 丙酮(或指甲油清洗劑)
- 組織
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