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熱隔離填料

原名
Thermal Gap Filler

貨號
TOL-14283

特價
343

資料來源:https://www.sparkfun.com/products/14283

This Thermal Gap Filler provides 1.1W/mK of thermal conductivity that can conform to most surfaces. It’s perfect for high-value products that you need to keep cool, as it is a poor conductor of electricity while remaining a great conductor of heat! No additional adhesive is required when applying the Thermal Gap Filler, as it is naturally tacky and sticks to whatever you need it to — just be sure that’s where you need it!

This gap filler is what we use on our Stepoko motion controller as well as what we recommend to use with our ESP32 Thing Power Control Shield, as it is both electrically insulating and stable from -40°C to 160°C while meeting a UL 94 VO rating.

Features:

  • Soft and compressible for low-stress applications
  • Naturally tacky, needing no further adhesive coating
  • 1.1 W/mK thermal conductivity
  • Comes in 9"x9" sheets

Documents:

該熱隔離填料提供1.1W / mK的熱導率,可符合大多數表面。對於您需要保持冷靜的高價值產品而言,它是完美的,因為它是一個可憐的導體,同時保持一個偉大的導熱!應用熱隔離填料時,不需要額外的粘合劑,因為它自然發粘,堅持使用任何您需要的 - 只要確保您需要它!

這種間隙填料是我們在Stepoko運動控制器上使用的 ,以及我們推薦用於我們的ESP32 Thing功率控制屏蔽 ,因為它們在-40°C至160°C時都是電絕緣和穩定的,同時滿足UL 94 VO評級

特徵:

  • 軟和可壓縮的低應力應用
  • 自然發粘,不需要進一步的粘合劑塗層
  • 1.1 W / mK熱導率
  • 來自9“x9”張

文件:

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