官方授權台灣代理分銷
AE-CLOUD1 用於雲連接的應用程式示例
原名
AE-CLOUD1 Application Example for Cloud Connectivity
貨號
114991480
分類
RENESAS
特價
6,284
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資料來源：https://www.seeedstudio.com/AE-CLOUD1-Application-Example-for-Cloud-Connectivity-p-3021.html
Description
The Renesas Synergy™ AE-CLOUD1 Application Example for Cloud Connectivity is designed to allow the user to connect to Renesas IoT Sandbox and Synergy Enterprise Cloud Toolbox to build cloud based IoT solutions.
The AE-CLOUD1 kit contains the following:
S5D9 MCU Board with Ethernet and on-board sensors
Wi-Fi Board using Qualcomm Atheros QCA4002
Segger J-Link® Lite for Renesas Synergy™
Hardware
MCU Board: Featuring Renesas Synergy S5D9 MCU Group with Arm® Cortex®-M4F @120MHz with 2MB Flash and 640KB SDRAM. The MCU board also offers 256Mbits serial Nor QSPI Flash, 6-axis digital compass, microphone, barometric pressure, temperature and relative humidity sensors, 10/100Base-T Ethernet port, USB 2.0 Full Speed (Device and 5V Power), 2x Grove connectors (I2C/GPIO, UART/GPIO), and 3x colored LEDs (Red, Yellow, Green).
Wi-Fi Board: Offering 802.11 b/g/n using Qualcomm Atheros QCA4002 that is supported with the Synergy Wi-Fi Framework.
Debugger and Cable: Segger J-Link® Lite for Renesas Synergy™ debugger and cable
USB Cables: 2x A male to Micro B male 1ft cables.
Embedded Software
Programming at the API level using Synergy Software Package (SSP) with production ready RTOS, middleware, security, frameworks, libraries, and drivers.
Cloud Services
Support for Renesas IoT Sandbox – a free prototyping environment including cloud-based developer accounts and editable mobile apps for iOS and Android. Renesas IoT Sandbox is a great tool to use if you haven’t yet selected a cloud vendor but you need to quickly develop an IoT prototype. Build your first prototype in a day.
Ability to connect to Amazon Web Service, Microsoft Azure, and Google Cloud Platform in 10 minutes using the Synergy Enterprise Cloud Toolbox application project and associated Renesas cloud dashboard. With this reference design, you can save months on developing your Enterprise cloud connected product.
Useful Information
To get started: visit the kit website here.
Open Source Hardware: go from prototype to production easily by leveraging the kit’s board design for no charge. You can download the board design files here.
S5D9 MCU board documentation here.
Technical Details
| Weight | G.W 230g |
| Battery | Exclude |
Part List
| MCU board | 1 |
| Wi-Fi board | 1 |
| Segger J-Link® Lite debugger | 1 |
| Segger J-Link® Lite debugger cable | 1 |
| 1ft flat USB Type A to Micro-B cables | 2 |
描述
瑞薩Synergy™AE-CLOUD1雲連接應用示例旨在讓用戶連接到瑞薩物聯網沙箱和Synergy企業雲工具箱，以構建基於雲的物聯網解決方案。
AE-CLOUD1套件包含以下內容：
-
帶有以太網和板載傳感器的S5D9 MCU板
-
使用Qualcomm Atheros QCA4002的Wi-Fi板
-
適用於瑞薩Synergy™的Segger J-Link®Lite
硬件
-
MCU板： 具有ARM®Cortex®-M4F @ 120MHz的Renesas Synergy S5D9 MCU組，帶有2MB閃存和640KB SDRAM。 MCU板還提供256Mbits Nor QSPI閃存，6軸數字羅盤，麥克風，氣壓，溫度和相對濕度傳感器，10 / 100Base-T以太網端口，USB 2.0全速（設備和5V電源），2個Grove連接器（I2C / GPIO，UART / GPIO）和3個彩色LED（紅色，黃色，綠色）。
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Wi-Fi電路板： 使用Synergy Wi-Fi框架支持的Qualcomm Atheros QCA4002提供802.11 b / g / n。
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調試器和電纜： 適用於瑞薩Synergy™調試器和電纜的Segger J-Link®Lite
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USB電纜： 2x公頭到Micro B公頭1ft電纜。
嵌入式軟件
-
使用Synergy軟件包（SSP）和生產就緒RTOS，中間件，安全性，框架，庫和驅動程序在API級別進行編程。
雲服務
-
支持瑞薩物聯網沙箱 - 免費的原型開發環境，包括基於雲的開發者賬戶和可編輯的iOS和Android移動應用程序。 如果您尚未選擇雲供應商，瑞薩物聯網沙箱是一個很好的工具，但您需要快速開發物聯網原型。 在一天內建立你的第一個原型。
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能夠在10分鐘內使用Synergy企業雲工具箱應用程序項目和相關的瑞薩雲儀表板連接到Amazon Web Service，Microsoft Azure和Google Cloud Platform。 借助此參考設計，您可以節省數月時間開發企業雲連接產品。
有用的信息
技術細節
| 重量 | GW 230g |
| 電池 | 排除 |
零件清單
| MCU板 | 1 |
| Wi-Fi板 | 1 |
| Segger J-Link®Lite調試器 | 1 |
| Segger J-Link®Lite調試器電纜 | 1 |
| 1英尺扁平USB A型到Micro-B電纜 | 2 |
